High-density design

Our first designs were large pizzabox-sized boards that would fill many cabinets! Nowadays, most designs in consumer and industrial applications are heavily space-constrained: in many cases volume has gone down by three orders of magnitude or even more! Our long experience equips us ideally to deal with the challenges of miniaturization: we know how to shirk size, without compromising on reliability or increasing costs.

We can help you shrink your design using:
1.    high-density routing (down to 3 mils track thickness and spacing),
2.    large number of layers (the most complex design completed so far had 24),
3.    very high pin-count FINE PITCH and BGA packages (up to 1500 and even more),
4.    optimized placement of active and passive components on both sides.

In particular, we have long experience developing optimized layouts for the main families of programmable devices, such as the SPARTAN® and VIRTEX® series Xiling FPGA, CYCLONE® and STRATIX® series Altera FPGAsm ARM® and OMAP® series processors from Texas Instruments.

Our main customers for high-density design solutions include:

EUROTECH        (High Performance Computing, Embedded Devices and Systems)
EOPTIS            (Optoelectronic Instrumentation and Vision Systems)
MAS ELETTRONICA    (ARM-based Embedded Systems)
IPTRONIX        (Digital Video Processing and Streaming Systems)
LGL ELECTRONICS    (Thread Control Systems for Textile Products)